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High Performance Thermal Insulation Materials

Low Thermal Conductivity Materials

Low thermal conductivity heat-insulation materials exhibit high performance, thus saving energy and space for equipment.

They can be used in wide-ranging fields, such as industrial furnaces, combustors, and fuel cells

TOMBO No Product Name Description Dust Emission Max Temperature Sizes (mm) Data Sheet
4350-GH ROSLIM™ Board Superior machinability, low dust emision 0.018 [g/cm3] 1000°C 25, 50 x 600 x 900
 

High Performance Thermal Insulation Materials Downloads

Roslim Microporous Insulation Board Data Sheet
* TOMBO is a registered trademark or trademark of NICHIAS Corporation.
* All brand names and product names are trademarks of NICHIAS Corporation.